Microchip Serial EEPROM Memory Products What is the best way to build a zero-defect automobile? By using zero-defect components. How, then does one achieve zero-defect components? The quality must be designed-in; manufactured-in; and any remaining defects tested out. Microchip Technology has developed industry-leading processes for each step in the design, manufacturing and testing phases of its serial EEPROMs, and has become one of the most respected leaders in supply of these devices to the automotive industry – worldwide. Zero field returns for bit failures during the past several years, across several billion units shipped, is testimony to Microchip’s commitment to quality and reliability. This along with Microchip’s broad EEPROM portfolio and commitment to excellence in support and delivery, ensures a one-stop solution for truly robust, world class products. Wafer-level Burn-in For Quality and Reliability Microchip’s Triple Test Flow is currently the most robust testing procedure for serial EEPROM devices in the industry. It tests each cell of each die three times and also performs extensive E/ W endurance and data retention tests to ensure quality and reliability. Infant mortality of Microchip serial EEPROMs is among the lowest in the industry due to this extensive testing, excellent
fabrication and highly reliable memory cell design. Microchip tests every cell of every die twice! Then we perform a final test after assembly: - First Wafer Probe: All die are checked to ensure conformance to data sheet specs. A high temperature sort is performed where all bits are erased and written 5,000 times to weed out any failures, weak cells or single-point defects.
- Retention Bake: A high temperature stress test that helps accelerate charge loss. The wafers are baked at 250ºC for up to 24 hours.
- Second Wafer Probe: All die are again tested to make sure that the data from the first wafer probe is still correct – after 5000 E/W cycles and a high-temperature bake. Failed bits are identified as well as cells that have lost any charge throughout the process. These die are also rejected as they may have a propensity to fail.
- Assembly and Final Test: Final test done after assembly. 100% tested while maintaining world class line yields
Read more | 
